Effect for TFT-LCD glass substrate main physical characteristics

Glass substrate TN / STN, TFT-LCD applications, the required characteristics of surface properties ﹑ ﹑ chemical resistance, heat resistance, and alkali metal content, etc.; these only affect the glass substrate for TFT-LCD of the main physical properties are described below :
1 Tension Point (Strain Point): is the glass density plot of an indicator shall be resistant Optoelectronics LCD production process of high temperature.

(2) Specific gravity: for TFT LCD Display, the notebook is currently the largest market, so the density of the glass substrate as small as possible in order to transport and carry.

3 Thermal expansion coefficient: The coefficient determines the glass caused by temperature changes due to expansion or contraction of the appearance of the size scale, the coefficients as low as possible, so that the large screen of the expansion and contraction to a minimum.

The rest of the physical characteristics of indicators are still melting, softening point, chemical resistance, mechanical strength, optical properties and electrical properties, etc., can according to the user's specific needs to be regulated.

The glass substrate manufacturing process, the main techniques include feed back-sheet forming and processing of three parts, wherein the feed formulation technology mainly in the quality control, the first glass in the high temperature furnace will be a low viscosity material melting and uniform molten glass, not only to consider the physical and chemical properties of the glass, and the need not change the chemical composition of the condition, select the best formulation of raw materials, in order to effectively decrease the glass melting temperature, the glass clear, and to achieve specific properties of glass, meet the needs of practical application.OLED Display The sheet molding technology is relevant to dimensional accuracy, surface properties, and the need for further processing of grinding to achieve specific physical and chemical characteristics required rear section contains the glass partition processing, grinding, washing and heat treatment processes.